Direct air impingement cooling of package structures

摘要

Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.

主权项

1. A cooling assembly comprising:
a first array of vertically separated micro channels coupled to a first heat spreader, wherein the first heat spreader is finless, and wherein the first array of vertically separated micro channels includes a plurality of inlet micro channels and a plurality of outlet micro channels, and which each outlet micro channel has two adjacent inlet micro channels, such that there are twice as many inlet micro channels as outlet micro channels within the first array of vertically separated micro channels; a first heat pipe embedded in the first heat spreader, wherein the first heat pipe has a liquid/fluid coolant disposed therein; a second heat spreader disposed above the first heat spreader; and a fluid source coupled to the first array of vertically separated micro channels, wherein the liquid/fluid coolant of the first heat pipe is separate from the fluid source of the first array of vertically separated micro channels.