| 发明名称 | Narrow-gap flip chip underfill composition | ||
| 摘要 | An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles. | ||
| 申请公布号 | US9611372(B2) | 申请公布日期 | 2017.04.04 |
| 申请号 | US201615047866 | 申请日期 | 2016.02.19 |
| 申请人 | Intel Corporation | 发明人 | Xiu Yonghao;Ananthakrishnan Nisha;Bai Yiqun;Krishnan Arjun |
| 分类号 | H01L21/50;C08K3/00;H01L21/56;H01L23/00;H01L23/29 | 主分类号 | H01L21/50 |
| 代理机构 | Schwegman Lundberg & Woessner, P.A. | 代理人 | Schwegman Lundberg & Woessner, P.A. |
| 主权项 | 1. A method of making an underfill composition comprising: combining a first quantity of first filler particles having a first particle size and a second quantity of second filler particles having a second particle size with a curable resin, wherein the second particle size is smaller than the first particle size, wherein the second quantity of the second filler particles in the underfill composition is selected to provide for a weight percentage loading of the second filler particles that is below or proximate to a cutoff threshold where the viscosity of the underfill composition begins to increase, and wherein the first quantity of the first filler particles and the second quantity of the second filler particles in the underfill composition are selected to provide for one or more of: a specified thermal property of the underfill composition when cured, a specified electrical property of the underfill composition when cured, or a specified viscosity of the underfill composition when uncured. | ||
| 地址 | Santa Clara CA US | ||