发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 To improve reliability of SRAM. In a memory cell of the SRAM, a coupling capacitance is provided between memory nodes in consideration of dynamic stability.
申请公布号 US2017092649(A1) 申请公布日期 2017.03.30
申请号 US201615270132 申请日期 2016.09.20
申请人 RENESAS ELECTRONICS CORPORATION 发明人 TAKAOKA Hiromichi
分类号 H01L27/11;H01L23/535;H01L21/311;H01L49/02 主分类号 H01L27/11
代理机构 代理人
主权项 1. A semiconductor device comprising: a first SRAM cell with a first capacitive element provided between a first node connected to a first bit line and a second node connected to a second bit line; and a second SRAM cell with a second capacitive element provided between a third node connected to the first bit line and a fourth node connected to the second bit line, wherein the first capacitive element is disposed to be closer to the first bit line side than to a middle point of the first bit line and the second bit line, and the second capacitive element is disposed to be closer to the second bit line side than to the middle point of the first bit line and the second bit line.
地址 Tokyo JP