| 摘要 |
A floor polishing or grinding pad assembly (10) is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad (12), a reinforcement layer or ring (14; 114), and multiple floor-contacting disks (16; 16a; 16b; 16c; 116). In another aspect, the reinforcement layer includes a central hole (17) through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension (x) greater than a linear dimension (y) of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle (α) offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks (116) alternating between and/or offset from a larger set of the disks (16). In another aspect, the reinforcement layer includes a wavy or undulating internal edge (117) shape. |
