发明名称 PACKAGE STRUCTURE
摘要 A package structure includes an encapsulant, an active component, a first lead frame segment, and a second lead frame segment. The active component is encapsulated within the encapsulant and includes first and second electrodes. The first and second electrodes are respectively disposed on and electrically connected to the first and second lead frame segments. The first and second lead frame segments respectively have first and second exposed surfaces. The first exposed surface and the first electrode are respectively located on opposite sides of the first lead frame segment. The second exposed surface and the second electrode are respectively located on opposite sides of the second lead frame segment. The first and second exposed surfaces are exposed outside the encapsulant. A minimal distance from the first electrode to the second electrode is less than a minimal distance from the first exposed surface to the second exposed surface.
申请公布号 US2017092570(A1) 申请公布日期 2017.03.30
申请号 US201615157896 申请日期 2016.05.18
申请人 DELTA ELECTRONICS, INC. 发明人 TSAI Hsin-Chang;LEE Peng-Hsin
分类号 H01L23/495;H01L23/367;H01L23/00;H01L23/31 主分类号 H01L23/495
代理机构 代理人
主权项 1. A package structure, comprising: an encapsulant; an active component encapsulated within the encapsulant, the active component comprising a first electrode and a second electrode; a lead frame structure comprising a first lead frame segment and a second lead frame segment, wherein the first electrode is disposed on and electrically connected to the first lead frame segment, wherein the first lead frame segment has a first exposed surface, wherein the first exposed surface and the first electrode are respectively located on opposite sides of the first lead frame segment, and wherein the first exposed surface is exposed outside the encapsulant, wherein the second electrode is disposed on and electrically connected to the second lead frame segment, wherein the second lead frame segment has a second exposed surface, wherein the second exposed surface and the second electrode are respectively located on opposite sides of the second lead frame segment, and wherein the second exposed surface is exposed outside the encapsulant, wherein a minimal distance from the first electrode to the second electrode is less than a minimal distance from the first exposed surface to the second exposed surface.
地址 Taoyuan City TW