主权项 |
1. A package structure, comprising:
an encapsulant; an active component encapsulated within the encapsulant, the active component comprising a first electrode and a second electrode; a lead frame structure comprising a first lead frame segment and a second lead frame segment, wherein the first electrode is disposed on and electrically connected to the first lead frame segment, wherein the first lead frame segment has a first exposed surface, wherein the first exposed surface and the first electrode are respectively located on opposite sides of the first lead frame segment, and wherein the first exposed surface is exposed outside the encapsulant, wherein the second electrode is disposed on and electrically connected to the second lead frame segment, wherein the second lead frame segment has a second exposed surface, wherein the second exposed surface and the second electrode are respectively located on opposite sides of the second lead frame segment, and wherein the second exposed surface is exposed outside the encapsulant, wherein a minimal distance from the first electrode to the second electrode is less than a minimal distance from the first exposed surface to the second exposed surface. |