发明名称 MANUFACTURING METHOD OF LIGHT EMITTING DEVICE
摘要 A manufacturing method of a side view type light emitting device including a package body made of a synthetic resin material, the manufacturing method includes: providing an injection molding mold, for injection-molding the package body, including: a first mold provided with a first convex part for forming an upper surface side flat part on an upper surface of the package body; and a second mold provided with a first concave part for forming the upper surface side flat part; and fitting the first concave part around the first convex part so as to enter a liquid tight state with no space, injecting the synthetic resin material into each of the first and second molds so as to be filled therein, and hardening the synthetic resin material to form the package body in a state in which the first mold and the second mold are aligned with each other.
申请公布号 US2017087751(A1) 申请公布日期 2017.03.30
申请号 US201615271086 申请日期 2016.09.20
申请人 TOYODA GOSEI CO., LTD. 发明人 TANAKA Motoyuki;TSUCHIYA Yosuke;TAJIMA Hiroyuki
分类号 B29C45/00;B29D11/00 主分类号 B29C45/00
代理机构 代理人
主权项 1. A manufacturing method of a side view type light emitting device, the side view type light emitting device including a package body made of a synthetic resin material, the manufacturing method comprising: providing an injection molding mold for injection-molding the package body, the injection molding mold including: a first mold provided with a first convex part for forming an upper surface side flat part on an upper surface of the package body; and a second mold provided with a first concave part for forming the upper surface side flat part; and fitting the first concave part around the first convex part so as to enter a liquid tight state with no space, injecting the synthetic resin material into each of the first and second molds so as to be filled therein, and hardening the synthetic resin material to form the package body in a state in which the first mold and the second mold are aligned with each other.
地址 Kiyosu-shi JP