METAL FOIL, METAL FOIL PROVIDED WITH RELEASE LAYER, LAMINATE BODY, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, ELECTRONIC APPARATUS, AND PRINTED CIRCUIT BOARD PRODUCTION METHOD

摘要

Provided is a metal foil that, when the metal foil has been provided with a release layer and then stuck onto a resin substrate, makes it possible for the resin substrate to be physically peeled away and, as a result, during a process wherein the metal foil is removed from the resin substrate, can be removed at a favorable cost without the profile that has been transferred onto the surface of the resin substrate from the surface of the metal foil being damaged. The metal foil also makes it possible for resins that have different resin components to be stuck together with favorable adhesion. A metal foil that has one or more surface that has surface irregularities that have a root mean square height Sq of 0.25-1.6 μm.