发明名称 TAMPER-RESPONDENT ASSEMBLIES
摘要 Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
申请公布号 US2017094806(A1) 申请公布日期 2017.03.30
申请号 US201514941887 申请日期 2015.11.16
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BRODSKY William L.;BUSBY James A.;ISAACS Phillip Duane;LONG David C.
分类号 H05K3/12;H05K3/30;H05K3/46 主分类号 H05K3/12
代理机构 代理人
主权项 1. A fabrication method comprising: fabricating a tamper-respondent assembly, the fabricating comprising: providing a tamper-respondent electronic circuit structure, the providing comprising providing a tamper-respondent sensor, the providing the tamper-respondent sensor comprising: providing at least one flexible layer having opposite first and second sides; andproviding circuit lines forming at least one resistive network, the circuit lines being disposed on at least one of the first side or the second side of the at least one flexible layer, and the circuit lines having a line width Wl≦200 μm, and a line-to-line spacing width Ws≦200 μm.
地址 Armonk NY US