| 发明名称 |
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS |
| 摘要 |
There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate. |
| 申请公布号 |
US2017092504(A1) |
申请公布日期 |
2017.03.30 |
| 申请号 |
US201615267183 |
申请日期 |
2016.09.16 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
KUBO Akihiro;KODAMA Teruhiko |
| 分类号 |
H01L21/304;B24B37/20;H01L21/308;H01L21/67;H01L21/02 |
主分类号 |
H01L21/304 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate processing method comprises:
polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate. |
| 地址 |
Tokyo JP |
