| 发明名称 |
TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME |
| 摘要 |
In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy. |
| 申请公布号 |
US2017088965(A1) |
申请公布日期 |
2017.03.30 |
| 申请号 |
US201515122568 |
申请日期 |
2015.02.25 |
| 申请人 |
DOWA METALTECH CO., LTD. ;YAZAKI CORPORATION |
发明人 |
Murata Tatsunori;Kotani Hirotaka;Endo Hideki;Sugawara Akira;Sonoda Yuta;Kato Tetsuo;Ohsumi Hideki;Toyoizumi Jyun |
| 分类号 |
C25D5/12;C25F1/00;B32B15/01;C25D3/38;C25D3/32;C25D5/50;C25D5/34;C25D3/12 |
主分类号 |
C25D5/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A tin-plated product wherein a surface of a substrate is plated with tin, the tin-plated product comprising:
a substrate of copper or a copper alloy; an underlying layer formed on a surface of the substrate, the underlying layer being formed of at least one of nickel and a copper-nickel alloy; and an outermost layer formed on a surface of the underlying layer, the outermost layer being composed of a copper-tin alloy layer and tin layers, the copper-tin alloy layer being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on an outermost surface of the outer most layer, wherein an area ratio occupied by the tin layers on the outermost surface is 20 to 80%, and a maximum thickness of the tin layers is smaller than an average particle diameter of the crystal grains of the copper-tin alloy. |
| 地址 |
Tokyo JP |
