发明名称 |
POLYIMIDE RESIN AND POLYIMIDE FILM |
摘要 |
A polyimide resin including a structural unit shown by formula (1-1), and a polyimide film including a structural unit shown by formula (1-2) and having a thickness of 10-50 μm. (In formula (1-1), R1 and R2 are each independently a group of any of formulas (i)-(iv); in formula (1-2), R1 and R2 are each independently a group of formula (i) or formula (ii); * in these formulas bonds to carbons marked with an * in formula (1-1) and formula (1-2), and ** bonds to carbons marked with an ** in formula (1-1) and formula (1-2).) Provided are a polyimide resin that makes it possible to form a polyimide film having excellent transparency and a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion. |
申请公布号 |
WO2017051783(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
WO2016JP77562 |
申请日期 |
2016.09.16 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
MATSUMARU, Teruhisa;SUENAGA, Shuya;ABIKO, Yohei |
分类号 |
C08G73/10;B32B27/34;C08J5/18 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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