Apparatus For Mounting Components On A Substrate

摘要

An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the component is to be mounted. The first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component. The pick and place system moves the carriage from a take-up location of the component to the substrate location in a respective predetermined height H1 above the second optical deflection system, so that the bottom side of the component is located in a focal plane of the camera, and lifts the carriage to a respective predetermined height H2, so that the substrate location is situated in the focal plane of the camera.

主权项

1. An apparatus for mounting components on a substrate, comprising
a support for the substrate, wherein a surface of the support defines a substrate plane, a pick and place system with a bonding head, wherein the pick and place system is set up to take up a component with the bonding head at a take-up location and to place said component on a substrate location, a camera for detecting a position of the component held by the bonding head and for detecting a position of the substrate location on which the component is to be mounted, a first optical deflection system, and a second optical deflection system,wherein
the camera has an optical axis, the pick and place system comprises a displaceable carriage on which the first optical deflection system, the camera and the bonding head are fastened, the second optical deflection system is arranged in a stationary manner on the apparatus, the first optical deflection system and the camera form a first image detection system for recording an image of the substrate location, wherein an object-side optical axis of the first image detection system extends at a distance from a gripping axis of the bonding head which is smaller than a distance between the gripping axis of the bonding head and the optical axis of the camera, the first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component, and the apparatus is programmed, for the recording of an image of the component, to move the carriage during the transport of the component from the take-up location to the substrate location at a predetermined height H1 above the substrate plane over the second optical deflection system, so that the bottom side of the component, during the travel over the second optical deflection system, is located in a focal plane of the camera, and for the recording of an image of the substrate location to lift the carriage to a predetermined height H2 above the substrate plane, so that the substrate location is located in the focal plane of the camera, wherein the two heights H1 and H2 are dimensioned in such a way that the optical length of the beam path between the bottom side of the component and the camera and the optical length of the beam path between the substrate location and the camera are equally large.