SEMICONDUCTOR DEVICE

摘要

In the semiconductor device, a bump electrode which connects a semiconductor chip and a wiring board is made up of a first part surrounded by an insulating film and a second part exposed from the insulating film. Since it is possible to reduce a width of the bump electrode while increasing a height of the bump electrode, a distance between the neighboring bump electrodes can be increased, and a filling property of a sealing material can be improved.

主权项

1. A semiconductor device comprising:
a semiconductor substrate; a conductive layer formed on the semiconductor substrate; a first insulating film which is formed on the conductive layer and covers the conductive layer; a second insulating film which is formed on the first insulating film and includes an opening which exposes a part of a surface of the conductive layer; a bump electrode which is made up of a first part which is in contact with the conductive layer and positioned in the opening and a second part which is positioned on the opening and exposed from the second insulating film; a terminal which is connected to the bump electrode and is formed on a surface of a wiring board; and a sealing material which fills a gap between the semiconductor substrate and the wiring board.