LOW PROFILE PACKAGE WITH PASSIVE DEVICE

摘要

Provided is a low-profile package and related techniques for use and fabrication. In an example, a low-profile package is provided. The low-profile package includes an exemplary integrated circuit (IC) having an active face, an integrated passive device (IPD) having a face, and a redistribution layer (RDL) disposed between the IPD and the IC. The IC is embedded in a substrate. The active face of the IC faces the face of the IPD in a face-to-face (F2F) configuration. At least one contact of the IPD is arranged in an overlapping configuration relative to the IC. The RDL is configured to electrically couple the IPD with the IC. The RDL can be disposed between the IPD and the IC, can be embedded in the substrate, and can be configured as an electromagnetic shield.

主权项

1. An apparatus, comprising:
an integrated circuit having an active face, wherein the integrated circuit is embedded in a substrate; an integrated passive device (IPD) having a face, wherein the active face of the integrated circuit faces the face of the IPD, and at least one contact of the IPD is arranged in an overlapping configuration relative to the integrated circuit; and a redistribution layer (RDL) disposed between the IPD and the integrated circuit, wherein the RDL is configured to electrically couple the IPD and the integrated circuit.