| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
A semiconductor package having, stacked in the following order, a heat dissipating member, a joining layer and an insulation member, wherein the heat dissipating member has an aluminum-diamond composite containing diamond grains and a metal containing aluminum; and the joining layer that joins the heat dissipating member and the insulation member is formed using a composite material having silver oxide fine particles or organic-coated silver fine particles having an average particle size of at least 1 nm and at most 100 μm. |
| 申请公布号 |
US2017092560(A1) |
申请公布日期 |
2017.03.30 |
| 申请号 |
US201515311268 |
申请日期 |
2015.05.26 |
| 申请人 |
DENKA COMPANY LIMITED |
发明人 |
MIYAKAWA Takeshi;KINO Motonori;ISHIHARA Yosuke |
| 分类号 |
H01L23/373;B23K35/30;H01L21/48;B22F1/02;B22F1/00;H01L23/367;B23K1/00;B23K35/36 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package having, stacked in the following order, a heat dissipating member, a joining layer and an insulation member, wherein:
the heat dissipating member comprises an aluminum-diamond composite containing diamond grains and a metal containing aluminum; and the joining layer that joins the heat dissipating member and the insulation member is formed using a composite material containing silver oxide fine particles or organic-coated silver fine particles having an average particle size of at least 1 nm and at most 100 μm. |
| 地址 |
Tokyo JP |
