发明名称 AUTONOMIC COOLING SYSTEM
摘要 Autonomic cooling of a substrate is achieved using a porous thermal protective layer to provide evaporative cooling combined with capillary pumping. The porous thermal protective layer is manufactured onto the substrate. A vascular network is integrated between the substrate and the protective layer. Applied heat causes fluid contained in the protective layer to evaporate, removing heat. The fluid lost to evaporation is replaced by capillary pressure, pulling fluid from a fluid-containing reservoir through the vascular network. Cooling occurs as liquid evaporates from the protective layer.
申请公布号 US2017089618(A1) 申请公布日期 2017.03.30
申请号 US201615274591 申请日期 2016.09.23
申请人 The Board of Trustees of the University of Illinois 发明人 COPPOLA Anthony;WHITE Scott R.;SOTTOS Nancy R.
分类号 F25B19/00;F25B41/06 主分类号 F25B19/00
代理机构 代理人
主权项 1. An autonomic cooling system comprising a fluid-containing reservoir connected to a material containing the fluid, the material comprising: (a) a porous thermal protective layer;(b) a substrate; and(c) a vascularized layer integrated between the protective layer and the substrate; where the system autonomically cools the material upon an application of sufficient heat from a heat source to the material, whereby the vascularized layer disperses the fluid throughout enough of the protective layer to produce a pressure gradient between the reservoir and the pores of the protective layer, the fluid in the protective layer evaporates to remove the applied heat, and the fluid lost by the evaporation is replaced via capillary pressure drawing fluid from the reservoir to the vascularized layer.
地址 Urbana IL US