LED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

主权项

1. A manufacturing method of a light-emitting diode (LED) package structure, comprising:
providing an LED package structure assembly, wherein the LED package structure assembly has a substrate layer, a first metallic layer disposed on the substrate layer, an LED chip set mounted on the first metallic layer, and an encapsulating gel layer covering the first metallic layer and the LED chip set; sawing the encapsulating gel layer by using a first blade until the substrate layer is sawed so as to form a plurality of sawing grooves, wherein the sawing grooves divide the encapsulating gel layer into a plurality of encapsulating gels; and sawing the substrate layer along the sawing grooves by using a second blade until the substrate layer is sawed to be a plurality of substrates, thereby the LED package structure assembly is divided into a plurality of LED package structures separated from each other; wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the first blade is greater than that of the second blade.