| 发明名称 |
Interconnection Structure, LED Module and Method |
| 摘要 |
In an embodiment, an interconnection structure includes a first semiconductor device including a conductive stud, a second device including a contact pad, an adhesive layer including an organic component arranged between a distal end of the conductive stud and the contact pad, the adhesive layer coupling the conductive stud to the contact pad, and a conductive layer extending from the conductive stud to the contact pad. The conductive layer has a melting point of at least 600° C. |
| 申请公布号 |
US2017092631(A1) |
申请公布日期 |
2017.03.30 |
| 申请号 |
US201514868488 |
申请日期 |
2015.09.29 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Standing Martin |
| 分类号 |
H01L25/16;H01L21/027;H01L23/00;H01L33/62;H01L25/075 |
主分类号 |
H01L25/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An interconnection structure, comprising:
a first semiconductor device comprising a conductive stud; a second device comprising a contact pad; an adhesive layer comprising an organic component arranged between a distal end of the conductive stud and the contact pad, the adhesive layer coupling the conductive stud to the contact pad; and a conductive layer extending from the conductive stud to the contact pad, the conductive layer having a melting point of at least 600° C. |
| 地址 |
Villach AT |
