| 摘要 |
The present disclosure discloses a chip packaging module, including: a first chip, where a first pad is disposed on a side neighboring to a front surface of the first chip; at least a second chip, where at least one second chip is disposed on a rear side of the first chip, each second chip has a second pad, and wherein the first pad of the first chip is connected to the second pad of the second chip via a redistribution layer. According to the chip packaging module in the present disclosure, a second chip is disposed on a rear side of a first chip, and a first pad is connected to a second pad via a redistribution layer. By means of a redistribution technology on surfaces of multiple chips, a lead of a pad on a front surface of a fingerprint recognition chip is masterly winded to the back for interconnection, so that an induction area on the front surface of the chip can fully contact with a human body. In addition, the multi-chip redistribution technology can also greatly narrow down an interconnection distance between chips, which improves efficiency of communication between chips. |
| 主权项 |
1. A chip packaging module, comprising:
a first chip, wherein a first pad is disposed on a side neighboring to a front surface of the first chip; and at least a second chip, wherein at least one second chip is disposed on a rear side of the first chip, each second chip has a second pad, and wherein the first pad of the first chip is connected to the second pad of the second chip via a redistribution layer. |
