HYBRID PITCH PACKAGE WITH ULTRA HIGH DENSITY INTERCONNECT CAPABILITY

摘要

A hybrid pitch package includes a standard package pitch zone of the package having only standard package pitch sized features that is adjacent to a smaller processor pitch sized zone of the package having smaller processor pitch sized features. The package may be formed by obtaining a package having standard package pitch sized features (such as from another location or a package processing facility), forming a protective mask over a standard package pitch zone of the package that is adjacent to a smaller processor pitch sized zone on the package, and then forming smaller processor pitch sized features (such as contacts, traces and interconnects) in the smaller processor pitch sized zone at a chip fabrication processing facility. The smaller processor pitch sized features can be directly connected to (thus reducing the package connection area needed) a chip or device having processor pitch sized features (e.g., exposed contacts).

主权项

1. A method of forming a hybrid pitch package comprising:
obtaining a package having standard package pitch sized features above and below a layer of the package (1) in a standard package pitch sized zone of the package and (2) in a smaller processor pitch sized zone of the package that is adjacent to the standard package pitch sized zone of the package; then forming a protective mask over the standard package pitch sized zone of the package; and then forming smaller processor pitch sized features above the layer of the package in the smaller processor pitch sized zone, wherein the smaller processor pitch sized features have a pitch at least three times smaller than that of the standard package pitch sized features.