| 发明名称 |
ELECTRONIC COMPONENT |
| 摘要 |
An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a plurality of first coils that are arranged inside the multilayer body in a stacking direction of the multilayer body and are electrically connected to each other; a plurality of second coils that are arranged inside the multilayer body in the stacking direction of the multilayer body and are electrically connected to each other; an inner ground electrode that is provided inside the multilayer body and is arranged between two of the first coils, which face each other in the stacking direction; and a ground terminal that is connected to the inner ground electrode. |
| 申请公布号 |
US2017092413(A1) |
申请公布日期 |
2017.03.30 |
| 申请号 |
US201615258223 |
申请日期 |
2016.09.07 |
| 申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
MATSUNAGA Minoru |
| 分类号 |
H01F27/28;H01F27/29;H01F27/40;H01F27/245 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component comprising:
a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a plurality of first coils that are arranged inside the multilayer body in a stacking direction of the multilayer body and are electrically connected to each other; a plurality of second coils that are arranged inside the multilayer body in the stacking direction of the multilayer body and are electrically connected to each other; an inner ground electrode that is provided inside the multilayer body and is arranged between two of the first coils that face each other in the stacking direction; and a ground terminal that is connected to the inner ground electrode. |
| 地址 |
Kyoto-fu JP |
