发明名称 Semiconductor Device with Non-Isolated Power Transistor with Integrated Diode Protection
摘要 A semiconductor device configured with one or more integrated breakdown protection diodes in non-isolated power transistor devices and electronic apparatus, and methods for fabricating the devices.
申请公布号 US2017092760(A1) 申请公布日期 2017.03.30
申请号 US201615378458 申请日期 2016.12.14
申请人 NXP USA, Inc. 发明人 Parris Patrice M.;Bode Hubert M.;Chen Weize;DeSouza Richard J.;Laudenbach Andreas;Neugebauer Kurt U.
分类号 H01L29/78;H01L29/36;H01L29/06;H01L29/10;H01L29/08 主分类号 H01L29/78
代理机构 代理人
主权项 1. A device comprising: a semiconductor substrate having a first conductivity type; a device separating region in the semiconductor substrate and having a second conductivity type, the device separating region defining an active area and extending in a vertical orientation in the substrate along a periphery of the active area but not extending across the active area in a lateral orientation in the substrate to isolate the active area; a body region in the active area and having the first conductivity type; and a drain region in the active area and having the second conductivity type, the drain region spaced from the body region to define a conduction path of the device; wherein a spacing between the device separating region and the body region establishes a first breakdown voltage lower than a second breakdown voltage in the conduction path.
地址 Austin TX US