TERAHERTZ TRANSMISSION CONTACTLESS PROBING AND SCANNING FOR SIGNAL ANALYSIS AND FAULT ISOLATION

摘要

An apparatus comprises a contactless sense probe, an electro optic sensor module, and a test signal emitter circuit. The contactless sense probe includes a photoconductive switch and the signal bandwidth of the photoconductive switch is variable. The test signal emitter circuit configured to apply a test signal to a device under test (DUT) at a first location of the DUT, wherein the test signal includes a test signal frequency. The electro-optic sensor module is coupled to the contactless sense probe and configured to: generate an impulse signal at the contactless sense probe using an optical signal input to the first photoconductive switch; sense the test signal frequency in the impulse signal using the contactless sense probe at a second location of the DUT; and generate an indication of a defect in the DUT when the test signal frequency is undetected in the impulse signal.

主权项

1. An apparatus comprising:
a contactless sense probe including a first photoconductive switch, wherein a signal bandwidth of the first photoconductive switch is variable; an electro-optic sensor module coupled to the contactless sense probe and configured to generate an impulse signal at the contactless sense probe using an optical signal input to the first photoconductive switch; and a test signal emitter circuit configured to apply a test signal to a device under test (DUT) at a first location of the DUT, wherein the test signal includes a test signal frequency, wherein the electro-optic sensor module is further configured to sense the test signal frequency in the impulse signal using the contactless sense probe at a second location of the DUT and generate an indication of a defect in the DUT when the test signal frequency is undetected in the impulse signal.