发明名称 |
VACUUM REACTING FORCE WELDING METHOD AND DEVICE THEREOF |
摘要 |
A vacuum reacting force welding method, comprising the following steps: a chip being die-bonded onto a substrate by means of a solder to form a semi-finished product (16); the semi-finished product being placed within a vacuum eutectic cavity (6) of a vacuum eutectic stove; vacuum-pumping the vacuum eutectic cavity; preheating the vacuum eutectic cavity to slowly increase the temperature; heating the vacuum eutectic cavity quickly to melt the solder; applying an acting force to the vacuum eutectic cavity to raise the vacuum eutectic cavity acceleratedly after lowering same; performing forced refrigeration to the exterior of the vacuum eutectic cavity, while introducing a protective gas to the interior thereof; releasing the vacuum state of the vacuum eutectic cavity after the solder is solidified. Also disclosed is a welding device using the vacuum reacting force welding method. The welding method and device can apply, under the precondition of avoiding damage to the chip, a reacting force with acceleration to the chip, effectively lowering the voidage of the welding spot. |
申请公布号 |
WO2017049511(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
WO2015CN90464 |
申请日期 |
2015.09.23 |
申请人 |
GUANGZHOU LEDTEEN OPTOELECTRONICS CO., LTD |
发明人 |
SU, Jiabing;QIN, Mingchao |
分类号 |
B23K1/008;B23K3/00 |
主分类号 |
B23K1/008 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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