| 发明名称 |
Semiconductor Package, Semiconductor Device and Method of Forming the Same |
| 摘要 |
According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes at least one chip, and at least one component adjacent to the at least one chip, wherein the at least one chip and the at least one component are molded in a same molding body. |
| 申请公布号 |
US2017092634(A1) |
申请公布日期 |
2017.03.30 |
| 申请号 |
US201615373719 |
申请日期 |
2016.12.09 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
发明人 |
YU CHEN-HUA;LIU CHUNG-SHI;HUANG CHIH-FAN;TSAI TSAI-TSUNG;LIN WEI-HUNG;CHENG MING-DA |
| 分类号 |
H01L25/18;H01L25/00;H01L23/31 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
at least one chip; at least one passive component; a mask layer having a recess formed therein, the mask layer being disposed between the at least one chip and the at least one passive component, and the chip, the passive component, and the mask layer being disposed in a same vertical level of the semiconductor package; and a molding compound disposed in the recess and having a thickness equal to a height of the recess. |
| 地址 |
Hsinchu TW |
