| 发明名称 |
DUAL-INTERFACE IC CARD MODULE |
| 摘要 |
The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110). |
| 申请公布号 |
US2017092612(A1) |
申请公布日期 |
2017.03.30 |
| 申请号 |
US201615283260 |
申请日期 |
2016.09.30 |
| 申请人 |
NXP B.V. |
发明人 |
Zenz Christian |
| 分类号 |
H01L23/00;G06K19/077;H01Q1/22 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A dual-interface integrated circuit card module, the module comprising:
a substrate having first and second opposing surfaces; a contact pad on the first surface of the substrate; an integrated circuit on the second surface of the substrate, the integrated circuit having electrical connections to the contact pad through the substrate; and a pair of antenna pads disposed in recesses in the second surface of the substrate and electrically connected to corresponding antenna connections on the integrated circuit. |
| 地址 |
Eindhoven NL |
