BALL PAD WITH A PLURALITY OF LOBES

摘要

In some forms, an electronic assembly includes a substrate; and a ball pad mounted on the substrate, wherein the ball pad includes a plurality of lobes projecting distally from a center of the ball pad. In some forms, he electronic assembly includes a substrate; and a ball pad mounted on the substrate, wherein the ball pad includes a lobe projecting distally from a center of the ball pad. In some forms, the electronic assembly includes a substrate; and a ball pad mounted on the substrate, wherein the ball pad includes at least one lobe projecting distally from a center of the ball pad; and an electronic package that includes at least one conductor that electrically connects the ball pad on the substrate to the electronic package.

主权项

1. An electronic assembly comprising:
a substrate that includes a conductive trace embedded within the substrate, wherein the conductive trace is exposed to an upper surface of the substrate; and a ball pad mounted on the upper surface of the substrate, wherein the ball pad engages the conductive trace and includes a plurality of lobes projecting distally from a center of the ball pad.