发明名称 FLEXIBLE CIRCUIT BOARD HAVING THREE-LAYER DIELECTRIC BODY AND FOUR-LAYER GROUND LAYER STRUCTURE
摘要 Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
申请公布号 WO2017052274(A1) 申请公布日期 2017.03.30
申请号 WO2016KR10673 申请日期 2016.09.23
申请人 GIGALANE CO., LTD. 发明人 KIM, Sang Pil;LEE, Da Yeon;KOO, Hwang Sub;KIM, Hyun Je;JUNG, Hee Seok
分类号 H05K1/02;H05K3/42;H05K3/46 主分类号 H05K1/02
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