发明名称 |
FLEXIBLE CIRCUIT BOARD HAVING THREE-LAYER DIELECTRIC BODY AND FOUR-LAYER GROUND LAYER STRUCTURE |
摘要 |
Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body. |
申请公布号 |
WO2017052274(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
WO2016KR10673 |
申请日期 |
2016.09.23 |
申请人 |
GIGALANE CO., LTD. |
发明人 |
KIM, Sang Pil;LEE, Da Yeon;KOO, Hwang Sub;KIM, Hyun Je;JUNG, Hee Seok |
分类号 |
H05K1/02;H05K3/42;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|