Direct Selective Adhesion Promotor Plating

摘要

A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.

主权项

1. A method of forming a packaged semiconductor device, comprising:
providing a lead frame strip having a plurality of unit lead frames, each of the unit lead frames comprising a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads; selectively plating an adhesion promoter plating material within a package outline area of a first unit lead frame, the die paddle and the interior portions of the leads being disposed within the package outline area and the exterior portions of the leads being disposed outside of the package outline area; and processing wire bond sites in the first unit lead frame such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material, wherein the wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.