THERMAL MANAGEMENT SOLUTIONS FOR MICROELECTRONIC DEVICES USING JUMPING DROPS VAPOR CHAMBERS

摘要

A thermal management solution may be provided for a microelectronic system, wherein a jumping drops vapor chamber is utilized between at least one microelectronic device and an integrated heat spreader. The microelectronic system may comprise a microelectronic device attached by an active surface thereof to a microelectronic substrate. The integrated heat spreader, having a first surface and an opposing second surface, is also attached to the microelectronic substrate with a jumping drops vapor chamber disposed between a back surface of the microelectronic device and the integrated heat spreader second surface. The jumping drops vapor chamber may comprise a vapor space defined by a hydrophilic evaporation surface on the microelectronic device back surface, a hydrophobic condensation surface on the integrated heat spreader second surface, and at least one sidewall extending between the hydrophilic evaporation surface and the hydrophobic condensation surface with a working fluid disposed within the vapor space.

主权项

1. A microelectronic system, comprising:
at least one microelectronic device having an active surface and an opposing back surface, wherein the at least one microelectronic device active surface is attached to a microelectronic substrate; an integrated heat spreader, having a first surface and an opposing planar second surface, attached to the microelectronic substrate; and a jumping drops vapor chamber disposed between the at least one microelectronic device back surface and the integrated heat spreader planar second surface, wherein the jumping drops vapor chamber comprises:
a vapor space defined by a hydrophilic evaporation surface formed on the at least one microelectronic device back surface, an opposing hydrophobic condensation surface formed on the integrated heat spreader planar second surface, and at least one sidewall extending between the hydrophilic evaporation surface and the hydrophobic condensation surface, wherein the at least one sidewall contacts the microelectronic device at the microelectronic and contacts the integrated heat spreader at the integrated heat spreader second surface; anda working fluid disposed within the vapor space.