ELECTRONIC DEVICE PROVIDED WITH AN INTEGRAL CONDUCTIVE WIRE AND METHOD OF MANUFACTURE

摘要

An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

主权项

1. An electronic device, comprising:
a supporting substrate having a mounting face and including an electrical connection network, an integrated circuit chip mounted on said mounting face of the supporting substrate and electrically connected to said electrical connection network, an encapsulation block including a primary encapsulation block in which the integrated circuit chip is embedded and which extends above and around the integrated circuit chip on said mounting face of the supporting substrate and an additional encapsulation block above the primary encapsulation block; and at least one additional wire made from an electrically conductive material embedded in said additional encapsulation block, said additional conductive wire being electrically connected to at least one of said integrated circuit chip and said electrical connection network.