LASER PROCESSING APPARATUS

摘要

Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively.

主权项

1. A laser processing apparatus comprising:
a first laser mechanism including a first chuck table for holding a first workpiece, first X moving means for moving said first chuck table in an X direction, first Y moving means for moving said first chuck table in a Y direction perpendicular to said X direction, and first focusing means for focusing a first laser beam to said first workpiece held on said first chuck table; a second laser mechanism including a second chuck table for holding a second workpiece, second X moving means for moving said second chuck table in said X direction, second Y moving means for moving said second chuck table in said Y direction, and second focusing means for focusing a second laser beam to said second workpiece held on said second chuck table; a laser oscillator for oscillating an original laser beam; an optical system for branching said original laser beam oscillated by said laser oscillator into said first laser beam and said second laser beam and leading said first and second laser beams to said first and second focusing means, respectively; a first operation panel for setting first processing conditions for said first laser mechanism; and a second operation panel for setting second processing conditions for said second laser mechanism.