| 摘要 |
Described is an apparatus which comprises: a via formed of a first material; and a first interconnect, formed of a second material, with an end region coupled to the via, wherein the first interconnect has an angled sidewall at the end region. Described is an apparatus which comprises: a via formed of a first material; and a first interconnect, formed of a second material, with an end region coupled to the via, wherein the first interconnect has a rougher interface for at least one wall of the first interconnect at the end region compared to at least another wall of the first interconnect. |
