ORGANIC ADDITIVE FOR ELECTROLYTIC COPPER PLATING COMPRISING TWO TYPES OF LEVELERS, AND ELECTROLYTIC COPPER PLATING SOLUTION CONTAINING SAME

摘要

An organic additive for electrolytic copper plating, according to one aspect of the present invention, is added to a copper plating solution for forming a copper film on a substrate having a pattern formed thereon by an electrolytic plating method, and comprises at least two types of levelers in order to increase the uniformity and flatness of the copper film formed on the pattern.