SURFACE-TREATED METAL FOIL, LAMINATED BODY, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

To provide a metal foil such that a release layer is provided to the metal foil to allow the metal foil to be physically peeled from a resin substrate once the metal foil has been affixed to the resin substrate, thereby making it possible to: remove the metal foil in a cost-efficient manner in a step for removing the metal foil from the resin substrate, without any damage to the profile of the surface of the metal foil transferred to the surface of the resin substrate; and cause resins having different resin components to be affixed together with high adhesiveness. A surface-treated metal foil having a surface-treated layer on at least one surface, wherein the water contact angle of the surface-treated-layer-side surface is 90° or greater.