发明名称 |
POLYURETHANE CMP PADS HAVING A HIGH MODULUS RATIO |
摘要 |
A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less. |
申请公布号 |
US2017087688(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
US201615273855 |
申请日期 |
2016.09.23 |
申请人 |
Cabot Microelectronics Corporation |
发明人 |
FU Lin;Ma Rachel;Speer Nathan;Tsai Chen-Chih;Bergman Kathryn |
分类号 |
B24B37/24;B24B37/04;B24B37/22 |
主分类号 |
B24B37/24 |
代理机构 |
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代理人 |
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主权项 |
1. A chemical-mechanical polishing pad comprising a thermoplastic polyurethane polishing layer having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. |
地址 |
Aurora IL US |