PREPREG, METAL-CLAD LAMINATED PLATE, WIRING BOARD, AND METHOD FOR MEASURING THERMAL STRESS OF WIRING BOARD MATERIAL

摘要

A prepreg comprises: a resin layer which is formed from a half-cured product of a heat-curable resin composition; and a fibrous base material which is arranged in the resin layer. The prepreg is so configured that the maximum value of a thermal shrinkage stress, which is measured by a specific thermal stress test using a prepreg specimen that is a cured article produced by thermally curing the heat-curable resin composition, is 400 kPa or less.