发明名称 |
CROSS TALK AND INTERFERENCE REDUCTION FOR HIGH FREQUENCY WIRELESS INTERCONNECTS |
摘要 |
Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas. |
申请公布号 |
WO2017052566(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
WO2015US52063 |
申请日期 |
2015.09.24 |
申请人 |
INTEL CORPORATION |
发明人 |
ELSHERBINI, Adel A.;KAMGAING, Telesphor;OSTER, Sasha N.;DOGIAMIS, Georgios C. |
分类号 |
H01Q1/52;H01Q1/38 |
主分类号 |
H01Q1/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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