| 摘要 |
A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 µm, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 µmol/dm 2 , and a total adhesion amount of the B element group is 40 to 900 µmol/dm 2 . |
