BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACKAGING METHOD

摘要

The present disclosure provides bond pad structures, boning ring structure; and MEMS device packaging methods. An exemplary bonding pad structure includes a plurality of first metal blocks made of a first metal material; and a plurality of second metal block made of a second metal material. The plurality of first metal blocks are configured to prevent the squeezing out and extending of the plurality of second metal blocks. On at least one equal dividing plane of the bonding pad structure, the first metal material is shown at least one time; and the second metal material is shown at least one time.