SHEET FOR PROCESSING SEMICONDUCTOR

摘要

A sheet (1) for semiconductor processing, the sheet (1) comprising a base material (2) and a pressure sensitive adhesive layer (3) laminated on at least one surface of the base material (2), the pressure sensitive adhesive layer (3) being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The sheet (1) for semiconductor processing can suppress contamination of an adherend at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property.