HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTICAL SEMICONDUCTOR DEVICE AND SEMICONDUCTIOR PACKAGE USING MOLDED PRODUCT OF SAME

摘要

Provided are a heat-curable silicone resin composition capable of forming a cured product having a superior long-term reliability and a low-warpage property; an optical semiconductor device and a semiconductor package each having the cured product of such composition that is obtained in compression molding. The heat-curable silicone resin composition contains a molten mixture of a resinous organopolysiloxane (A) and an organopolysiloxane (B); an inorganic filler(C); a curing catalyst (D); and a silane coupling agent (E). The components (A) and (B) are cured by a condensation reaction, and a difference between a storage elastic modulus of a cured product of the composition at 25°C and a storage elastic modulus of a cured product of the composition at 150°C is not larger than 4,000 MPa.