| 摘要 |
The present invention relates to a surface-treated copper foil and a method of manufacturing the same. The method of manufacturing a surface-treated copper foil includes a first step of preparing an electrolytic copper foil, a second step of pickling the surface of the electrolytic copper foil, a third step of forming a nodule by roughening the pickled electrolytic copper foil in a plating bath including at least one of Mo, Co, W, Mn, Cu, H 2 SO 4 , and Na, and a fourth step of forming a plating layer on the formed nodule. According to the present invention, it is possible to improve adhesion strength of a copper foil by roughening an electrolytic copper foil with metal ions of Mo, Co, W, Mn, and the like. |
