发明名称 |
MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME |
摘要 |
A MEMS sensor package comprises a MEMS die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. A port extends between the cavity and a side wall of the MEMS die and enables admittance of fluid into the cavity. Fabrication methodology entails providing a substrate structure having sensors formed thereon, providing a cap layer structure having inwardly extending cavities, and forming a channel between pairs of the cavities. The cap layer structure is coupled with the substrate structure and each channel is interposed between a pair of cavities. A singulation process produces a pair of sensor packages, each having a port formed by splitting the channel, where the port is exposed during singulation and extends between its respective cavity and side wall of the sensor package. |
申请公布号 |
EP3147257(A1) |
申请公布日期 |
2017.03.29 |
申请号 |
EP20160189538 |
申请日期 |
2016.09.19 |
申请人 |
NXP USA, Inc. |
发明人 |
Dawson, Chad, S;Hooper, Stephen, R;Li, Fengyuan;Salian, Arvind, S |
分类号 |
B81B7/00;B81C1/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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