发明名称 |
Method of mounting self-adhesive substrate on electronic device |
摘要 |
A method of mounting a self-adhesive substrate on an electronic device comprising steps of: (S01) providing a base for mounting at least one self-adhesive substrate thereon, wherein each self-adhesive substrate includes a copper circuit layer formed thereon, an insulated adhering layer adhered with the copper circuit layer and made of glue with thermal conductive powders, and a release layer attached with the insulated adhering layer; (S02) forming the at least one self-adhesive substrate on the base based on a profile or a circuit configuration of a fixing portion of an accommodating member of an electronic device; (S03) welding a plurality of electronic elements on the copper circuit layer of each self-adhesive substrate; (S04) removing each self-adhesive substrate; (S05) removing the release layer from each self-adhesive substrate to adhere each self-adhesive substrate on the fixing portion of the accommodating member of the electronic device. |
申请公布号 |
US9609761(B2) |
申请公布日期 |
2017.03.28 |
申请号 |
US201414505516 |
申请日期 |
2014.10.03 |
申请人 |
Chen Hung-Chang |
发明人 |
Chen Hung-Chang |
分类号 |
H05K3/30;H05K1/02;F21V19/00;H05K1/18;H05K3/00;F21Y101/00;F21Y105/10;F21Y115/10 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
1. A method of mounting a self-adhesive substrate on an electronic device comprising steps of:
(1) providing a base and forming at least one self-adhesive substrate, wherein each self-adhesive substrate includes a copper circuit layer formed thereon, an insulated adhering layer bonded to the copper circuit layer and made of glue with thermal conductive powders, and a release layer bonded to the insulated adhering layer; (2) fixing the at least one self-adhesive substrate on the base based on a shape or a circuit configuration of a bonding area of a surface of an electronic device, and mounting the base on the electronic device; (3) welding a plurality of electronic elements on the copper circuit layer of each self-adhesive substrate; (4) removing each self-adhesive substrate from the base; (5) removing the release layer from each self-adhesive substrate to adhere each self-adhesive substrate on the bonding area of the surface of the electronic device. |
地址 |
Taipei TW |