发明名称 Au—Ga—In brazing material
摘要 A brazing material which can be melted at a suitable temperature at which damage is not given to a device inside a package upon sealing, and besides the brazing material is not remelted, e.g., upon mounting to a board, and which has a low temperature difference between a liquidus and a solidus. The brazing material is made of a Au—Ga—In ternary alloy, wherein weight concentrations of the elements lie within a region of a polygon with a point A (Au: 90%, Ga: 10%, In: 0%), a point B (Au: 70%, Ga: 30%, In: 0%), a point C (Au: 60%, Ga: 0%, In: 40%) and a point D (Au: 80%, Ga: 0%, In: 20%) as vertexes (excluding lines on which In and Ga become 0%), in a Au—Ga—In ternary phase diagram.
申请公布号 US9604317(B2) 申请公布日期 2017.03.28
申请号 US201414460904 申请日期 2014.08.15
申请人 TANAKA KIKINZOKU KOGYO K.K. 发明人 Taniguchi Hiroyasu;Shimada Tomohiro;Miyazaki Kenichi
分类号 C22C5/02;B23K35/30;B23K35/02;H01L23/10 主分类号 C22C5/02
代理机构 Roberts & Roberts, LLP 代理人 Roberts & Roberts, LLP
主权项 1. A sealing method comprising brazing components with a brazing material, which brazing material comprises a Au—Ga—In ternary alloy, wherein weight concentrations of the elements lie within a region of a polygon with a point A (Au: 90%, Ga: 10%, In: 0%), a point B (Au: 70%, Ga: 30%, In: 0%), a point C (Au: 60%, Ga: 0%, In: 40%) and a point D (Au: 80%, Ga: 0%, In: 20%) as vertexes, excluding lines on which In and Ga become 0%, in a Au—Ga—In ternary phase diagram.
地址 Tokyo JP