Interconnect structure configured to control solder flow and method of manufacturing of same

摘要

An interconnect structure and method for manufacturing the same includes a substrate and a copper trace line defined on a surface of the substrate. The copper trace line includes a transmission line and a contact pad. The copper trace line is plated with a layer of metal which will oxidize if exposed to the atmosphere. The layer of metal is further plated with a layer of gold. The gold layer is selectively applied to the transmission line and the contact pad to define a gap on the transmission line at the contact pad. The metal layer is exposed in the gap. An oxide layer is formed on the metal layer in the gap. The oxide layer and the substrate surround the contact pad define a barrier to spread of solder.

主权项

1. An interconnect structure configured to control solder flow, comprising:
a dielectric substrate; a copper trace defined on a surface of said substrate, the copper trace defining at least a contact pad and a transmission line in contact with the contact pad; a metal layer covering said copper trace; and a gold layer covering the metal layer on the contact pad and transmission line, the gold layer defining a gap over a portion of the transmission line adjacent or near the contact pad, the metal layer exposed in the gap, an oxide being on the exposed metal layer.