发明名称 |
Recessed transistors containing ferroelectric material |
摘要 |
Some embodiments include transistor constructions having a first insulative structure lining a recess within a base. A first conductive structure lines an interior of the first insulative structure, and a ferroelectric structure lines an interior of the first conductive structure. A second conductive structure is within a lower region of the ferroelectric structure, and the second conductive structure has an uppermost surface beneath an uppermost surface of the first conductive structure. A second insulative structure is over the second conductive structure and within the ferroelectric structure. A pair of source/drain regions are adjacent an upper region of the first insulative structure and are on opposing sides of the first insulative structure from one another. |
申请公布号 |
US9608111(B2) |
申请公布日期 |
2017.03.28 |
申请号 |
US201514850824 |
申请日期 |
2015.09.10 |
申请人 |
Micro Technology, Inc. |
发明人 |
Ramaswamy Durai Vishak Nirmal |
分类号 |
H01L29/78;H01L27/115;H01L29/49;H01L29/788;H01L29/423;H01L29/51;H01L27/11521;H01L21/28;H01L29/66;H01L27/1159;H01L27/11597 |
主分类号 |
H01L29/78 |
代理机构 |
Wells St. John P.S. |
代理人 |
Wells St. John P.S. |
主权项 |
1. A transistor construction, comprising:
an upwardly-opening container-shaped first insulative structure within a silicon-containing base; an upwardly-opening container-shaped first conductive structure nested within a lower region of the container-shaped first insulative structure; an upwardly-opening container-shaped ferroelectric structure within the first insulative structure and over the first conductive structure; a second conductive structure within a lower region of the container-shaped ferroelectric structure; the second conductive structure having an uppermost surface beneath an uppermost surface of the first conductive structure; a second insulative structure over the second conductive structure and within the container-shaped ferroelectric structure; a pair of source/drain regions adjacent an upper region of the container-shaped first insulative structure and on opposing sides of the first insulative structure from one another; channel material along an outer region of the container-shaped first insulative structure and extending from one of the source/drain regions to the other; wherein the first conductive structure comprises one or both of titanium nitride and tantalum nitride; and wherein the ferroelectric structure comprises metal oxide. |
地址 |
Boise ID US |