发明名称 |
Method of supplying solder to printed circuit board |
摘要 |
Provided is a solder supply method of supplying, onto a mask sheet, solder to be printed on a printed circuit board. The method includes calculating an amount of solder supplied for a plurality of points in an X direction that is a lengthwise direction of a squeegee, and changing the amount of solder supplied at each point in the X direction based on a result of the calculation. |
申请公布号 |
US9609795(B2) |
申请公布日期 |
2017.03.28 |
申请号 |
US201313962773 |
申请日期 |
2013.08.08 |
申请人 |
YAMAHA HATSUDOKI KABUSHIKI KAISHA |
发明人 |
Narita Yoshitaka;Fujimoto Takeshi;Sato Hidetoshi |
分类号 |
G01R31/28;H05K13/04;B41F15/08;B41F15/42;H05K3/34;H05K3/12 |
主分类号 |
G01R31/28 |
代理机构 |
Studebaker & Brackett PC |
代理人 |
Studebaker & Brackett PC |
主权项 |
1. A solder supply method for a printing apparatus which includes a solder supply nozzle, a mask sheet, and a squeegee extending in an X-direction that is a lengthwise direction thereof such that, under control of a controller, solder is supplied onto the mask sheet via the solder supply nozzle and the squeegee is moved on the mask sheet along a Y-direction perpendicular to the X-direction so that solder is to be printed on a printed circuit board placed underneath the mask sheet, the method comprising:
(A) causing a detection sensor to detect an amount of a remaining solder remaining on the mask sheet for a plurality of points in the X direction of the squeegee after a first process of printing the solder and before a second process of printing the solder, (B) causing the controller to calculate an amount of solder to be supplied on the mask sheet for a plurality of points in the X direction based on a detecting result of the detection sensor; (C) causing the controller to change the amount of solder supplied at each point on the mask sheet in the X direction from the solder supply nozzle based on a result of the calculation, and (D) causing the solder supply nozzle to supply solder with an amount corresponding to a result of the change on the mask sheet for preparation of the second process of printing the solder. |
地址 |
Shizuoka-ken JP |