发明名称 Heat sink base and shield
摘要 A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.
申请公布号 US9606590(B2) 申请公布日期 2017.03.28
申请号 US201114357360 申请日期 2011.12.22
申请人 Hewlett-Packard Development Company, L.P. 发明人 Walker Paul N.;Moore Earl W
分类号 H05K7/20;G06F1/20;H01L23/36;H01L23/40;H05K3/30;H01L23/473 主分类号 H05K7/20
代理机构 HPI Patent Department 代理人 HPI Patent Department
主权项 1. A heat sink comprising: a metal base to be mounted to a circuit board of a computing system and to receive a component, wherein the metal base is to thermally contact a first face of the component; and a metal shield pivotally attached to the metal base, the metal shield to thermally contact a second face of the component, the second face opposite of the first face on the component, wherein the metal shield is pivotable between an open position with respect to the metal base and a closed position with respect to the metal base, wherein when the metal shield is pivoted to the open position, the component is insertable into a space between the metal base and the metal shield, and wherein the metal shield is pivotable from the open position to the closed position after insertion of the component to sandwich the component between the metal shield and the metal base.
地址 Houston TX US